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THERMAL PERFORMANCE OF PLATE FIN HEAT SINK COMBINED WITH COPPER FOAM

dc.contributor.authorNilpueng, Kitti
dc.contributor.authorAmani, Jafar
dc.contributor.authorDalkilic, Ahmet Selim
dc.contributor.authorAsirvatham, Lazarus Godson
dc.contributor.authorMahian, Omid
dc.contributor.authorWongwises, Somchai
dc.date.accessioned2026-06-27T14:19:44Z
dc.date.issued2019
dc.description.abstractThis paper presents the experimental investigation and comparison of thermal performance of plate fin heat sinks combined with copper foam, flat plate heat sinks combined with copper foam, and plate fin heat sinks. The effect of air velocity, pore density of the copper foam, and heat flux on thermal resistance and pressure drop is investigated. The experiments are carried out at air velocity ranging between 1 m/s and 5 m/s and heat flux ranging between 9.48 kW/m(2) and 12.59 kW/m(2). Copper foams with similar porosity and different pore density of 30 PPI, 40 PPI, and 50 PPI are used. The experimental results showed that the thermal resistance of PFHSfoam and FPHSfoam is decreased by 13.57% and 10.89% when the pore density increases at a low mass flux (G 2.89 kg/m(2).s for PFHSfoam and G > 3.88 kg/m(2).s for FPHSfoam), it is decreased by 7.97% and 4.39%. The thermal resistance of PFHS, PFHSfoam, and FPHSfoam changes slightly by the varying heat flux. The total pressure drop of PFHSfoam and FPHSfoam increases by about 1.72 times and 2.02 times on increase in the pore density between 30 PPI and 50 PPI. Under a similar pumping power, PFHSfoam gives the lowest thermal resistance, and thermal resistance of PFHSfoam and FPHSfoam is lower than that from PR-IS by about 40.74% and 25.18%.en
dc.description.sponsorshipResearch Chair Grant of the National Science and Technology Development Agency (NSTDA)
dc.description.sponsorshipThailand Research Fund (TRF)
dc.description.sponsorshipKing Mongkut's University of Technology Thonburi through the KMUTT 55th Anniversary Commemorative Fund
dc.description.urihttps://doi.org/10.1615/heattransres.2019025541
dc.identifier.doi10.1615/heattransres.2019025541
dc.identifier.eissn2162-6561
dc.identifier.endpage1613
dc.identifier.issn1064-2285
dc.identifier.issue16
dc.identifier.startpage1595
dc.identifier.urihttps://hdl.handle.net/20.500.14981/59319
dc.identifier.volume50
dc.identifier.wos000493793700003
dc.language.isoeng
dc.publisherBEGELL HOUSE INC
dc.relation.ispartofHEAT TRANSFER RESEARCH
dc.subjectthermal resistance
dc.subjectpressure drop
dc.subjectporosity
dc.subjectpore density
dc.subjectMETAL-FOAM
dc.subjectELECTRONICS DEVICES
dc.subjectFORCED-CONVECTION
dc.subjectPRESSURE-DROP
dc.subjectN-EICOSANE
dc.subjectFLOW
dc.subjectENHANCEMENT
dc.subjectMANAGEMENT
dc.subjectDESIGN
dc.subjectThermodynamics
dc.titleTHERMAL PERFORMANCE OF PLATE FIN HEAT SINK COMBINED WITH COPPER FOAM
dc.typeArticle
dspace.entity.typePublication
local.import.sourceWOS

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