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The Measurement of Thermal Conductivity Variation with Temperature for Sn-Based Lead-Free Binary Solders

dc.contributor.authorDemir, Mustafa
dc.contributor.authorAksoz, Sezen
dc.contributor.authorOzturk, Esra
dc.contributor.authorMarasli, Necmettin
dc.date.accessioned2026-06-27T13:31:01Z
dc.date.issued2014
dc.description.abstractThe variations of thermal conductivity with temperature in the Sn-based lead-free binary solders, Sn-10 wt pct X (X = Ag, In, Bi, Cu, Sb, Zn), were measured by using the linear heat flow apparatus. The thermal conductivities of Sn-based lead-free solders at their melting temperature were obtained from graphs of thermal conductivity variation with temperature. The variations of electrical conductivity with temperature for same solders were also determined from the Wiedemann-Franz (W-F) equation by using the measured values of thermal conductivity.en
dc.description.sponsorshipErciyes University Scientific Research Project Unit [FBA-10-3297]
dc.description.sponsorshipNevsehir University Scientific Research Project Unit [2012/5]
dc.description.urihttps://doi.org/10.1007/s11663-014-0109-9
dc.identifier.doi10.1007/s11663-014-0109-9
dc.identifier.eissn1543-1916
dc.identifier.endpage1749
dc.identifier.issn1073-5615
dc.identifier.issue5
dc.identifier.startpage1739
dc.identifier.urihttps://hdl.handle.net/20.500.14981/53450
dc.identifier.volume45
dc.identifier.wos000342443700017
dc.language.isoeng
dc.publisherSPRINGER
dc.relation.ispartofMETALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE
dc.subjectELECTRICAL CONDUCTIVITIES
dc.subjectINTERFACIAL ENERGIES
dc.subjectPURE METALS
dc.subjectALLOYS
dc.subjectLIQUID
dc.subjectSOLIDIFICATION
dc.subjectMaterials Science
dc.subjectMetallurgy & Metallurgical Engineering
dc.titleThe Measurement of Thermal Conductivity Variation with Temperature for Sn-Based Lead-Free Binary Solders
dc.typeArticle
dspace.entity.typePublication
local.import.sourceWOS

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