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Solving a layout design problem by analytic hierarchy process (AHP) and data envelopment analysis (DEA) approach

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Item type:Araştırmacı/Yazar,
TUZKAYA, Umut Rıfat

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SPIE-INT SOC OPTICAL ENGINEERING

DOI

10.1117/12.518054
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Today, growing amounts of waste due to fast consumption rate of products started an irreversible environmental pollution and damage. A considerable part of this waste is caused by packaging material. With the realization of this fact, various waste policies have taken important steps. Here we considered a firm, where waste Aluminum constitutes majority of raw materials for this fir0m. In order to achieve a profitable recycling process, plant layout should be well designed. In this study, we propose a two-step approach involving Analytic Hierarchy Process (AHP) and Data Envelopment Analysis (DEA) to solve facility layout design problems. A case example is considered to demonstrate the results achieved.

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ENVIRONMENTALLY CONSCIOUS MANUFACTURING III

ISSN

0277-786X

ISBN

0-8194-5151-7

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