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Recent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines: A Critical Review

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dc.contributor.authorOz, Ozkan
dc.contributor.authorOzer, Halil
dc.date.accessioned2026-06-27T14:15:15Z
dc.date.issued2018
dc.description.abstractAdhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints.en
dc.description.urihttps://doi.org/10.7569/raa.2018.097302
dc.identifier.doi10.7569/raa.2018.097302
dc.identifier.eissn2168-0973
dc.identifier.endpage103
dc.identifier.issn2168-0965
dc.identifier.issue1
dc.identifier.startpage82
dc.identifier.urihttps://hdl.handle.net/20.500.14981/58491
dc.identifier.volume6
dc.identifier.wos000437129800003
dc.language.isoeng
dc.publisherSCRIVENER PUBLISHING LLC
dc.relation.ispartofREVIEWS OF ADHESION AND ADHESIVES
dc.subjectBi-adhesive
dc.subjectmodulus-graded adhesive
dc.subjectanalytical and numerical studies
dc.subjectFINITE-ELEMENT-ANALYSIS
dc.subjectFRP COMPOSITE PLATES
dc.subjectNUMERICAL-SIMULATION
dc.subjectTEE JOINT
dc.subjectFAILURE
dc.subjectSTRESSES
dc.subjectPERFORMANCE
dc.subjectSTRENGTH
dc.subjectMODEL
dc.subjectMONO
dc.subjectMaterials Science
dc.titleRecent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines: A Critical Review
dc.typeReview
dspace.entity.typePublication
local.import.sourceWOS

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