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Chemical etching of Cu-ETP copper

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dc.contributor.authorÇakir, O
dc.contributor.authorTemel, H
dc.contributor.authorKiyak, M
dc.contributor.institutionauthorKIYAK, Murat
dc.contributor.institutionauthorÇAKIR, Orhan
dc.date.accessioned2026-06-27T13:02:19Z
dc.date.issued2005
dc.description.abstractChemical etching is the controlled dissolution of workpiece material by contact with strong chemical solution. The process can be applied to any material. Copper is one of the extensively used engineering material in the fabrication of microelectronic components, microengineered structures and precision parts by using chemical etching process. In this study, copper is chemically etched. with two different etchants (ferric chloride and cupric chloride) at 50 degrees C. The effects of selected etchants and machining conditions on the depth of etch and surface roughness were investigated. The experimental study provided that ferric chloride produced the fastest chemical etch rate, but cupric chloride produced the smoothest surface quality. (c) 2005 Elsevier B.V. All rights reserved.en
dc.description.urihttps://doi.org/10.1016/j.jmatprotec.2005.02.035
dc.identifier.doi10.1016/j.jmatprotec.2005.02.035
dc.identifier.endpage279
dc.identifier.issn0924-0136
dc.identifier.startpage275
dc.identifier.urihttps://hdl.handle.net/20.500.14981/49314
dc.identifier.volume162
dc.identifier.wos000229375500044
dc.language.isoeng
dc.publisherELSEVIER SCIENCE SA
dc.relation.conference8th International Conference on Advances in Materials and Processing Technologies/13th International Conference on Achievements in Mechanical and Materials Engineering
dc.relation.ispartofJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
dc.subjectchemical etching
dc.subjectcopper depth of etch
dc.subjectsurface roughness
dc.subjectPRINTED-CIRCUITS
dc.subjectFOIL
dc.subjectEngineering
dc.subjectMaterials Science
dc.titleChemical etching of Cu-ETP copper
dc.typeArticle; Proceedings Paper
dspace.entity.typePublication
local.import.sourceWOS

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