Heat transfer and fluid flow characteristics in a plate heat exchanger filled with copper foam

Abstract

A small plate heat exchanger filled with copper foam which can be applied for small scale electronic cooling is presented. The heat transfer coefficient and pressure drop of water flow inside a plate heat exchanger filled with copper foam (PHECF) are experimentally studied. The effect of copper foam pore density and water velocity on the optimum thermal performance is also presented. The experiment is performed with a Reynolds number ranging from 1200 to 2000 and copper foam pore density ranging from 30 to 50 pores per inch (PPI). The results show that the heat transfer coefficient and pressure drop increased when the water velocity and pore density increased. The heat transfer coefficient is enhanced by 20.23%, 29.37%, and 40.28% for PHECF with a pore density of 30 PPI, 40 PPI, and 50 PPI as compared to a plate heat exchanger. The total pressure drop of water flow inside PHECF is dominated by inertial drag pressure drop. Thermal performance of PHECF with 50 PPI is highest with the average thermal performance factor of 1.21. The Nusselt number and friction factor correlation of water flow inside plate heat exchanger filled with copper foam are also proposed for practical applications.